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Advanced Thermal Management in a Compact Design
Engineered with controlled porosity and complex internal geometries to improve heat transfer, reduce weight, and optimize flow performance in demanding applications.
Key Capabilities
Manage heat from mission-critical electronics, sensors, communication systems, and payloads operating in compact spacecraft environments.
Higher heat transfer performance with reduced size, weight, and power.
Support next-generation onboard computing and AI-enabled systems with advanced thermal solutions designed for high-density processing environments.
Maintain performance and reliability under increasing thermal loads.
Enable efficient thermal management for cryogenic storage, transport, and mission systems requiring precise temperature control.
Reliable performance in extreme temperature conditions.
Improve thermal control for electric propulsion architectures through lightweight, high-performance heat management solutions.
Optimize propulsion efficiency while reducing system mass.
| Parameter | Capability |
| Manufacturing Method | Controlled-Porosity Additive Manufacturing (CPAM) |
| Construction | Monolithic Designs with Integrated Solid & Porous Structures |
| Design Approach | Custom Engineered for Mission Requirements |
| Porosity Control | Tunable Porosity Based on Thermal Performance Requirements |
| Flow Paths | Custom Internal Geometries and Fluid Channels |
| Manufacturing Capability | Prototype Through Production Volumes |
| Heritage | Built on Flight-Proven Porous Thermal Management Technologies |
| Applications | Electronics Cooling, Heat Spreaders, Loop Heat Pipes, Thermal Control Systems |
Porous structures increase surface area and improve thermal transfer efficiency compared to traditional designs
Achieve higher thermal performance while minimizing mass and package size for space-constrained systems.
Create components with both solid and porous regions in a single print, reducing assembly complexity and potential leak paths.
Complex internal channels, lattice structures, and optimized thermal geometries are possible using CPAM technology.
Built upon Mott’s long history of supplying porous titanium and nickel wick structures for aerospace thermal management systems.
Each heat exchanger can be optimized to meet mission-specific thermal, pressure, and packaging requirements
Mott’s thermal management expertise extends beyond additive manufacturing. Our porous titanium and nickel wick structures have supported aerospace thermal control systems for decades, providing a proven foundation for next-generation heat exchanger designs.
By combining proven porous materials technology with controlled-porosity additive manufacturing (CPAM), Mott delivers custom thermal solutions capable of addressing today’s most challenging heat transfer problems.
Manufactured in Mott’s AS9100-certified facility in Farmington, Connecticut, supporting mission-critical aerospace and defense applications.
Whether you’re designing cooling systems for spacecraft electronics, advanced payloads, satellite platforms, or other mission-critical aerospace applications, Mott’s engineering team can help develop a heat exchanger optimized for your performance requirements.
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Call us at 860.747.6333 or submit an information request form and someone will get back to you within 48 hours.
Headquarters:
75 Spring Lane
Farmington, CT 06032
Customer Innovation Center:
84 Spring Lane
Farmington, CT 06032